Tuesday, October 7, 2008

Supply Chain News: What is the Tipping Point for Bringing Back Production to Domestic Market?


Supply Chain News: What is the Tipping Point for Bringing Back Production to Domestic Market?



Logistics Costs as Percent of Total and Infrastructure Costs are the Two Key Drivers, says MIT's David Simchi-Levi

 
 

 

SCDigest Editorial Staff


With the dramatic rise in fuel prices and thus transportation costs, there is growing evidence that some companies are relooking at the numbers and, in some cases, deciding to bring back production from Asia to domestic sources or "nearshore" low-cost countries, such as Mexico for the US or Eastern European countries for Europe.

"For every company and product, there is of course a "tipping point" where rising logistics costs negate the unit cost advantages of China or other Asian countries," says Dr. David Simchi-Levi of MIT, who has been doing research in this area..

Earlier this year, Simchi-Levi did an analysis for Supply Chain Digest that showed how rising transportation costs would impact optimal network design as the price of oil reached progressively higher levels.  (See Oil Prices and Supply Chain Network Design.) In one case, using real customer data, the analysis showed that as the price of oil went over $150 per barrel, triggering a corresponding increase in transportation costs, one consumer goods company should move a substantial amount of production volume from Mexico to a factory in Omaha to have the lowest total supply chain cost. Even though the US unit manufacturing costs were higher, they were offset by lower shipping costs to customers.

"Now, what we are starting to see is that, what we predicted might happen then, actually beginning to occur," Simchi-Levi said. He added that he has seen a number of companies that either put Asian offshoring plans on hold or, in some cases, brought production back to domestic or nearshore sources.

Impact of Logistics Costs

Simchi-Levi said he has been looking at a variety of macro-economic data for the past 4-5 years. He said that during that time, transportation costs have risen by about 40% - and not surprisingly, inventory carrying costs have also risen about 50%.

Why? In the constant trade-off between transportation and inventory costs, rising fuel costs ultimately mean it is cheaper on the margin to hold more inventory if doing so can reduce other logistics costs.



 

Two Decision Drivers

Simchi-Levi says that to facilitate this analysis, it is helpful to consider two variables in a simple 2-by-2 matrix. First, are logistics costs to move products from Asian factories as a percent of total supply chain costs high or low? Second, are the costs or barriers to move infrastructure from Asia high or low?

While each company may define the boundaries differently, such a matrix can be used to visually assess where a company's products fall. For example, products with high logistics costs as a percent of total costs and with low costs or barriers to moving the infrastructure are the prime candidates for moving sourcing back from Asia. Conversely, products with low logistics costs and high costs to move infrastructure likely won't make sense to reconsider.

Those products in-between the two extremes need to be evaluated in even more detail, though in some cases the inability to move the infrastructure may preclude any sort of move. For example, if the domestic supplier base is gone, it may be impractical to return to domestic sourcing even if the physical factory itself could be easily and cheaply reconstituted in the home country.

"If logistics costs are a relatively low percent of total supply chain costs, then clearly even a substantial rise in those costs is not likely to have a large impact on optimal sourcing decisions," said Simchi-Levi.

Simchi-Levi says he has already seen makers of products such as furniture and televisions bring production back from Asia to either the US or Mexico. In the case of furniture, the primary factor is high relative logistics costs. With high-end televisions, it is part logistics costs, and part the cost of the long lead-times associated with Asian sourcing.

"With flat panel televisions, for example, the market price can decline by as much as 8-10% per month," Simchi-Levi said. "So, with 40-50 day cycle time from China, the product could lose 15% of its value. With Mexican sourcing, the cycle time may be only 7 days, and there is little loss in the value of the inventory."

Simchi-Levi says we are early in this trend, and it is not clear, especially with volatile oil prices, how permanent it will be. However, he said it is important for companies to be aware of the "tipping points" where Asian sourcing no longer is the best choice, and have enough flexibility in the supply chain to react accordingly.

"There is always a tipping point," said Simchi-Levi. "What is important is to monitor the supply chain to know when it is close to being reached for various products."


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Product Life Cycle Management



Product Life Cycle Management is the succession of strategies used by management as a product goes through its product life cycle. The conditions in which a product is sold changes over time and must be managed as it moves through its succession of stages.

Product life cycle

The product life cycle goes through many phases and involves many professional disciplines and requires many skills, tools and processes. Product life cycle (PLC) has to do with the life of a product in the market with respect to business/commercial costs and sales measures; whereas product lifecycle management (PLM) has more to do with managing descriptions and properties of a product through its development and useful life, mainly from a business/engineerin g point of view.To say that a product has a life cycle is to assert four things that products have a limited life, product sales pass through distinct stages, each posing different challenges, opportunities, and problems to the seller,profits rise and fall at different stages of product life cycle, products require different marketing, financial, manufacturing, purchasing, and human resource strategies in each life cycle stage.

The different stages in a product life cycle are:

1. Market introduction stage

* cost high
* sales volume low
* no/little competition - competitive manufacturers watch for acceptance/segment growth losses
* demand has to be created
* customers have to be prompted to try the product

2. Growth stage

* costs reduced due to economies of scale
* sales volume increases significantly
* profitability
* public awareness
* competition begins to increase with a few new players in establishing market
* prices to maximize market share

3. Mature stage

* Costs are very low as you are well established in market & no need for publicity.
* sales volume peaks
* increase in competitive offerings
* prices tend to drop due to the proliferation of competing products
* brand differentiation, feature diversification, as each player seeks to differentiate from competition with "how much product" is offered
* Industrial profits go down

4. Decline or Stability stage

* costs become counter-optimal
* sales volume decline or stabilize
* prices, profitability diminish
* profit becomes more a challenge of production/distribu tion efficiency than increased sales
Ref
 

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How A Microprocessor Is Made


How A Microprocessor Is Made

Silicon: The foundation for all Intel microprocessors
A microprocessor is an integrated circuit built on a tiny piece of silicon. Silicon is used because it is a semiconductor. Semiconductors are a class of materials whose electrical conductivity is between that of a conductor and that of an insulator. Silicon can be altered to be either an insulator, which blocks an electrical charge, or a conductor, which lets the electrical charge pass through.
A microprocessor contains millions of transistors, which are interconnected through extremely fine wires made of aluminum or copper. The transistors work together to store and manipulate data so that the microprocessor can perform a wide variety of functions.
Microprocessor production: Approximately 300 steps from start to finish
Making microprocessors is a complex, demanding process involving more than 300 steps. Microprocessors are built by layering materials on top of thin rounds of silicon, called wafers, through various processes using chemicals, gases and light.
Wafers are usually 200 mm, or 8 inches, in diameter. However, starting in 2001, Intel will also use wafers that measure 300 mm, or 12 inches, in diameter. The wafers are made from silicon, the principal ingredient of common beach sand, that has been purified and liquefied and grown into long, cylindrical tubes called "ingots." The ingots are sliced into thin wafers, which are polished until they have flawless, mirror-smooth surfaces.
In chip making, very thin layers of material, in carefully designed patterns, are put on the blank silicon wafers. The patterns are computerized designs that are miniaturized so that up to several hundred microprocessors can be put on a single wafer.
Because the patterns are so small, it is impossible to deposit material exactly where it needs to be on the wafer. Instead, a layer of material is deposited or grown across the entire wafer surface. Then, the material that is not needed is removed and only the desired pattern remains.
While there are more than 300 steps required to make a working microprocessor, the chip making process can be summarized in a few steps that involve growing silicon dioxide and creating conductive properties, testing, packaging, and shipping.
Growing silicon dioxide and creating conductive properties
The microprocessor manufacturing process begins with "growing" an insulating layer of silicon dioxide on top of a polished wafer. This oxide layer also acts as an electrical "gate" that either enables or prevents the flow of electrical current within the microchip. The silicon dioxide is grown on the surface of the wafer in a furnace at very high temperature. The thickness of the oxide layer depends on the temperature and the amount of time the wafers are in the furnace.
Photolithography, the process in which circuit patterns are printed on the wafer surface, is next.. First, a temporary layer of a light-sensitive material called a "photoresist" is applied to the wafer. Ultraviolet light shines through the clear spaces of a stencil called a "photomask" or "mask" to expose selected areas of the photoresist. Masks are created during the design phase and are used to define the circuit pattern on each layer of a chip. Exposure to light chemically changes the uncovered portions of the photoresist.
The exposed areas of photoresist are removed, revealing a portion of the silicon dioxide underneath. This revealed silicon dioxide is removed through a process called "etching." Then, the remaining photoresist is removed, leaving a pattern of silicon dioxide on the silicon wafer. Additional materials, such as polysilicon, which conducts electricity, are deposited on the wafer through additional lithography and etching steps. Each layer of material has a unique pattern. Together, they will form the chip's circuitry in a three-dimensional structure.
In an operation called "doping," the exposed areas of the silicon wafer are bombarded with various chemical impurities called "ions," which provide positive and negative charges, thereby altering the way the silicon in these areas conducts electricity. The electrical charges help the transistor to turn on and off, thereby passing electrical current through the transistor's gate.
To provide a link to the additional layers put on the wafer, "windows" are formed by repeating the masking and etching steps.
This layering is repeated 20 to 25 times over a period of several weeks. This process creates a skyscraper effect of layers on top of the wafer.
Metal is applied to fill in the "windows," thereby forming electrical connections between the chip's layers. Intel introduced copper metal on its 0.13-micron process technology, the most advanced microprocessor process generation in production today. Previously, Intel used aluminum metal in its 0.18-micron and older process technology. Copper and aluminum are excellent electrical conductors.
Testing
Once the layering is complete, the wafers are prepared for testing. In order to withstand the processes and equipment used in the layering process, wafers must be relatively thick. This thickness must be reduced by 33 percent before the wafers can be cut into individual microprocessors. Thus, the wafer goes through a series of steps to reduce its thickness and to remove impurities from its backside. Once the wafer's thickness is reduced, a layer of another material is deposited on the backside of the wafer to provide a good surface for die to be attached at assembly. This also provides an electrical contact from the back of the integrated circuit to the external package during the assembly process.
The wafers are then tested to determine the quality of each processing step. Separate components, such as transistors, resistors and capacitors are tested to determine whether or not the chips function properly. If a processing problem exists, this data can be analyzed to determine what processing step caused the problem.
Electrical probes are then placed on each die on the wafer and each die is energized. A computer completes a series of tests to determine if the circuit meets specifications.
Packaging
After wafers are tested, they are sent to Intel's assembly facilities where each wafer is cut into tiny rectangles, called "die," each containing a complete integrated circuit. A precision saw separates the die from one another. The non-functional dies are then discarded.
The individual dies are then assembled into external packages. These packages protect the die from the environment and provide the electrical connections for the die to communicate with the circuit board onto which it will later be mounted. Tiny balls of solder are bonded from designated areas on the die to the electrical leads on the package. Now, electricity can travel from the printed circuit to the die and back again.
After package assembly, a test is run to determine if the die are still functional. Non-functional units are rejected. The functional units are then put through stress tests. During these tests, each individual unit is put through different humidity and temperature levels and checked for electro static discharge levels. After each stress test, the unit is tested to determine the functional level. The units are then placed in specific bins, depending on the speed and power performance of the unit.
Shipping
Qualified integrated circuits are then given an outgoing inspection. This is to verify that all previous tests were correct and the integrated circuit meets or exceeds customer standards. All integrated circuits that pass inspection are marked and packed in boxes to be sent to customers.
About Intel
Intel (NASDAQ: INTC), the world leader in silicon innovation, develops technologies, products and initiatives to continually advance how people work and live. Additional information about Intel is available at www.intel.com/ pressroom and blogs.intel. com.
 

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Forging Cost Saving Tips


Forging Cost Saving Tips

Problem + Solution = Savings

RINGS

Flame cutting a ring from plate is not economical when meeting material requirements.
• Flame cutting, all corner stock and the full center slug is lost even though you pay for it.
• As desired thickness of the ring increases, availability of plate sizes and grades drastically decreases.
• Uni-directional grain flow of plate increases susceptibility of ring to fatigue failure.

A custom forged ring allows greater versatility and improved quality while reducing material cost.
• The forging process moves and shapes material to ordered ring size with minimal material waste.
• Required ring thickness has no effect on the virtually limitless combinations of sizes and grades available.
• The porosity and laminations sometimes encountered in plates is eliminated with a custom forged ring.
• Contoured grain flow within forged ring yields combination of strength, toughness and fatigue resistance.

30% MATERIAL SAVINGS
Material=4340
Finished Size=46 5/8" O.D. X
  26 1/4" I.D. X 4 1/8" FACE
Materials Needed to Produce=
  Forging=2,015 lbs.
  Plate=2,865 lbs.

56% MATERIAL SAVINGS
Material=1021
Finished Size=22 5/8" O.D. X
  17" I.D. X 9" FACE
Materials Needed to Produce=
  Forging=700 lbs.
  Plate=1,580 lbs.

BARS & SHAFTS

Matching a solid bar to form a step down causes expensive use of material, labor and time.
• When machining the step down, all excess material, as shown here, is lost.
• Machining time, tool life and freight costs are expensive.
• Grain flow within the bar is exposed when machined, thus making the material more susceptible to fatigue failure.

Custom forging the bar to form a step down lowers the cost for a value added part.
• Forging requires less starting material, thus saving cost on excess material waste.
• Less machining saves money, time and tool life while producing a closer-to-finish shape.
• Freight and handling costs are lowered because the forged step down weighs less than the bar.
• Contoured grain flow within forged step down yields greater impact and directional strength.

64% SAVINGS
Forged Sizes=18 1/4" O.D. X
  16 1/2" Long, Step 11 1/4" O.D. X
  8" Long, Step 6 3/4" O.D. X
  48" Long
Weight=1,935 lbs.
Bar Size=18 1/4" O.D. X 72 1/2"
Long
Weight=5,375 lbs.

49% SAVINGS
Forged Sizes=4" O.D. X
  13 1/16" Long, Step 6 1/2" O.D. X
  9 3/4" Long, Step 4" O.D. X
  19 13/16" Long
Weight=205 lbs.
Bar Size=6 1/2" O.D. X 42 1/4" Long
Weight=400 lbs.

HUBS

When hub shapes are achieved through machining solid bar stock or flame cutting plate, waste is an expensive part of the process.
• When machining a shape from solid bar or flame cutting plate, all excess material is lost. See the illustration below.
• Machining or flame-cutting means costly machine time, lowered tool life, and increased freight costs.
• Most importantly, the uni-directional grain flow of both bar and plate increases the likelihood of fatigue

Custom forging of hub shapes improves quality, lowers material costs and offers maximum flexivility.
• As it requires less material from the start, forging saves on both material and freight.
• The forging process requires simple tooling yet can produce virtually limitless combinations of single or double hub sizes.
• Reduces machining saves time, labor, and tooling costs and forging produces a nearer net shape.
• The optimum combination of strength, toughness, and fatigue resistance in the hub is achieved by the continuous grain flow which comes through forging.

59% MATERIAL SAVINGS
Forged Sizes=4" O.D. X
  20" Face, Hub on side 9" O.D. X
  4 1/2" Projection
Weight=346 lbs.
Plate Size=20" Square X 7 1/2"
Thick
Weight=850 lbs.

43% MATERIAL SAVINGS
Forged Sizes=18 1/4" O.D. X
  3 7/8" Face, Hub on side 10 5/8"
O.D. X 6 1/8" Projection with a 3"
I.D. through
Weight=421 lbs.
Bar Size=18 1/4" O.D. X 10" Long
Weight=741 lbs.
 

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What is Lean Manufacturing


Lean manufacturing involves producing goods by using less resources as compared to what is required in mass production. It requires less work hours, manufacturing space, investment for tools as well as engineering time for producing products. It minimizes the operating costs and at the same time, satisfying the consumer's need for quality at the lowest possible price.


Technically, lean manufacturing is a standard procedure administration viewpoint derived from the (TPS) Toyota Production System, along with some other resources.  

Lean manufacturing is famous for its diminution of the creative Toyota 'seven wastes' to enhance the entire consumer worth. 

Due to the strategic importance on diminution of procedure deviation and Toyota's joint utility with the (TPS), "Lean" is often associated with Six Sigma.. The stabilized growth of Toyota from a small player, to the largest car firm on the globe has directed attention to how this was achieved.  This made "Lean" a sizzling subject in administrative science in the initial decade of the 21st century. 

Evolution and Functions:

Lean manufacturing evolved out of lean proposition, "the cure to waste".  Waste particularly signifies any activity that attracts resources, but generates no value.  Lean manufacturing offers a way to identify value and assemble value-generating actions in the finest order.  

Several organizations in the USA, UK, India, Germany, and Japan have availed enormously, by interpreting their lean proposition into standardized world class lean manufacturing organizations. 

These associations have attained high-quality, high-efficiency, overall consumer satisfaction, appropriate delivery actions, and enterprise superiority with fewer costs.  

Below mentioned are certain advantages of Lean Manufacturing:

- It minimizes the overhead fixed cost to 30%.
- It doubles the sales.
- Profits go up to four times high.
- Cuts the lead time by 50% to 90%.
- Amount of sales per official is ten times high.
- Procedure rows are cut by 70%.
- Annoyance is less on-the-job.

Below mentioned are some working ethics of Lean Manufacturing:

- Additional, quicker, and in advance over-production.
- A minimum of one-piece stock flow.
- Non-zero defect percentages.
- Over-dispensation.
- Aptitudes and inspirations of people.
- Actions & conveyance.

Methods and Gears of Lean Manufacturing:

- Price Plotting.
- One-Piece Surge.
- Single Minute Exchange Dies (SMED).
- Visual Administration.
- Line Modification.
- Complete Creative Continuation.
- Synchronous Manufacturing.
- 4S (Sustain, Separate, Standardize, and Simplify).
- Jidoka and Error Verification (Pola Yoke).
- Stock Management through Card System (KanBan).

A firm can attain Lean Manufacturing technique by following the below mentioned guidelines:

- Through evaluating the ongoing procedure.
- With comprehending the consumer's wish and upcoming market trends.
- Stock ups and guidance by Sr. executive.
- With the application of Lean with dealers..
- Application of Lean into off-line and non-manufacturing regions such as Marketing, Engineering, and Design.
- Application of Lean away from the source providing chain businesses, enthralling consumers.
- By broadening the Lean applications to all the secondary areas, until a complete incorporated manufacturing procedure is attained.
- Application of Lean gears and methods at the most vital procedures.
- By developing intense information about the manufacturing procedure.

Other Advantages:

Prime advantage viewed by many professionals applying lean manufacturing methods and its principles is the diminution of manufacturing time.  Hence, Lean Manufacturing assists firms to preserve, control and importantly boost their incomes, broaden their scopes and produce investments from lower costs.

Lean Manufacturing apparently and effectually flaunts its advantage on all the space difficulties faced by most of the manufacturing companies. It is unspoken, but is really a crucial aspect from the company's development point of view. 

It is also evidenced by human resource and labor estimates that, embracing on fine and efficient lean manufacturing techniques and principles perhaps assists firms to minimize their substantial working floor space requirement from 5% to 30%.  

The number of profit would appear a bit miniscule to your eyes, but it will truly and importantly proffer more efficacy and savings in your manufacturing philosophy. 
 
Research has proved that firms applying and following rigorous lean manufacturing principles appreciably hoist their manufacturing productivity by 75% to 125%.. Since, time and exertions are predominantly focused in lean manufacturing procedures.   

Hence, eradication of wastes and needless objects from the working space, undoubtedly and virtually aids the workers to get on their jobs with a soft and speeding comfort.  Productivity is automatically maximized, as workers are no longer disturbed with any intrusions and disruptions. Thereby, lean manufacturing from the productivity view is also important practice to achieve the set productivity target..    

The ultimate thing is that, when consumer satisfaction is attained, definitely sales will go up. Enhancement of services and manufactured products is the finest way to institute a good rapport with the consumers. For this, lean manufacturing greatly assists to attain a fine consumer rapport. 

Modernization, lean configuration of the organization and rationalization are certain other advantages achieved by firms worldwide, by implementing lean manufacturing principles and its functions. 

Lean manufacturing adheres to standardized cultures, thereby minimizing those adverse actions and outcomes on both the person and the administration if not eradicated. 

Supreme advantage of lean manufacturing with regards to cultures accepted by firms is that it flaunts the variations among the administration and employees. The working principles of Lean Manufacturing have to be surely applied by the manufacturing firms, as it is the peak time to garner its advantageous packages.

Although, there are many advantages of lean manufacturing, its disadvantages cannot be ignored. It basically relates to the severe implementation of this technique to supply chains lacking quickness can result into shortages in production.

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Friday, October 3, 2008

Remember Common Cause Variation in Fight Against Waste

 
 
Ideally, practitioners want an error rate to be at 0 percent. But if an error rate is steadily hovering at about 2 percent, it is fair to say that the errors are due to common cause variation. If the error rate suddenly surges beyond its usual level, however, it is probably due to some change to the product, such as variations in material, workmanship or test codes. This change is called special cause variation.
Practitioners typically approach these forms of variation differently, with special cause variation taking priority. But it may be profitable for practitioners and company leaders to reconsider their focus and pay closer attention to variation stemming from common causes.

Giving Attention to Variation

In most situations, special cause variation captures the attention of the management team because this form of manufacturing waste is not budgeted for in the accounting book.
 
Typically, companies allocate a certain amount of money for manufacturing waste. The amount is based on past performance. When special cause events – which are usually not forecasted – occur, they can drastically affect certain business transactions, such as fulfilling a customer's order, and can eat into the money budgeted for waste. Therefore, much effort and attention is put into resolving special cause events when they occur.
Contrarily, common cause variation is a known variation that is due to process noise and is typically inherited from the first day of production. Furthermore, the manufacturing waste generated from common cause variation is predictable, meaning it is usually budgeted for. As such, it may get less attention as compared to special cause events.

Reconsidering Waste

Although special cause variation may be the main focus, common cause variation is consistently contributing to manufacturing waste. It is generated from sources such as rework, retesting and scrap, and this waste is a cost to the business. For instance, rework cost is incurred by labor, material and transport logistics, and retesting incurs labor cost and takes up tester capacity. These costs affect the organization' s profitability.

The Real Cost of Common-cause Variation

The following example illustrates the importance of paying attention to common cause variation. In this case, the error rate of a test station is consistently hovering at about 2 percent.
 
If 2 percent of products go for rework, additional labor will be needed to work on them. which is an additional cost to the business. On the other hand, if the defective products are retested, it will take up 2 percent of the tester's capacity. Hence, the company may need to buy additional testers in order meet total shipment requirements. If the 2 percent of products that fail at the test station are scrapped, then the money has gone down the drain.
 
Despite common cause variation maintaining its 2 percent level, the production volume goes up, and the number of defects also will go up proportionally.. This rise in products that fail testing requires more money allocated for additional equipment, labor, testers and other supporting tools. Again, these additional costs eat into the profitability of a company.
Practitioners also should be considering the snowball effect from the defects generated by common cause variation. For instance, if the deposition of a rework or retest is not clearly defined, the defective products will continuously loop within the test processes. A reasonable number of cycles must be established for reworking and retesting for each failed unit. Apart from incurring additional costs and testing capacity, the snowball effect may generate other negative outcomes, such as taking up storage capacity.
This scenario is based on a single error code. If the manufacturing process has multiple error codes and each error code has its own common cause variation, the waste generated can be quite significant.

Fighting Variations to Stay Competitive

Lean methodology states that retesting, rework, unnecessary movement and inventory pileup are part of manufacturing waste. Therefore, effort to reduce costs due to such waste generated from common cause variation is essential.
In order to stay competitive in today's market, practitioners must do more than fire fight special cause events – they must thoroughly investigate the sources of common cause variation.
 
About the Author: How Tzek Chong is working in Singapore for Hitachi Global Storage Technology, a subsidiary of Hitachi Ltd. that makes hard disk drives. He is a Black Belt and also the deployment Champion for the factory

 
 

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Credit crunch will hit cost of manufacturing in China


Credit crunch will hit cost of manufacturing in China

Behind the turmoil in the world's financial markets potentially far-reaching changes to the cost of manufacturing in China have gone virtually unnoticed.

Undoubtedly the world's lowest cost area for manufacturing, China has become the production powerhouse of the world especially in electronic products. The belief was that this imbalance in the cost of production east-to-west would continue, if not for ever, but for many years ahead.

But changes to the Chinese and world economies in the last few months have dented that belief and there is a real likelihood that China may become a more expensive place to makes things in the future.

The process has already begun. The rising cost of fuel has pushed up transportation costs for companies shipping finishing product halfway around the world from factories in China to markets in Europe and the US. In recent years the cost of sending container ships around the world has more than doubled.

While the UK grapples with the possibility of recession, we must not forget that China has economic worries of its own. And as is the way with China they are on a whole different scale.

Inflation is China is running at over 5% this is putting pressure on wages in a way that is typical here in Europe, but which is a new phenomenon in China.

The Chinese Government has steadily throughout the summer been putting in place laws which increase workers rights particularly in respect to a minimum wage.

The implications for electronics companies are clear. As the cost of manufacturing in China continues to rise, the argument for moving more production offshore, particularly the higher value manufacturing which still resides in Europe, weakens.

Much production has already gone and it will take big changes in the Chinese cost model to bring it back. But the process may already have started with some companies putting the break on plans to move any more production to China.

I believe there are signs that the economic changes of the last few months have made some companies re-visit the benefits of having a European production base.


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